JPH0134351Y2 - - Google Patents
Info
- Publication number
- JPH0134351Y2 JPH0134351Y2 JP1980163066U JP16306680U JPH0134351Y2 JP H0134351 Y2 JPH0134351 Y2 JP H0134351Y2 JP 1980163066 U JP1980163066 U JP 1980163066U JP 16306680 U JP16306680 U JP 16306680U JP H0134351 Y2 JPH0134351 Y2 JP H0134351Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- semiconductor chip
- cap
- semiconductor
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- 230000017525 heat dissipation Effects 0.000 claims description 12
- 239000002470 thermal conductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000006023 eutectic alloy Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910015365 Au—Si Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980163066U JPH0134351Y2 (en]) | 1980-11-14 | 1980-11-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980163066U JPH0134351Y2 (en]) | 1980-11-14 | 1980-11-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5784750U JPS5784750U (en]) | 1982-05-25 |
JPH0134351Y2 true JPH0134351Y2 (en]) | 1989-10-19 |
Family
ID=29521873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980163066U Expired JPH0134351Y2 (en]) | 1980-11-14 | 1980-11-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0134351Y2 (en]) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59944A (ja) * | 1982-06-25 | 1984-01-06 | Agency Of Ind Science & Technol | 半導体装置 |
JPS6059756A (ja) * | 1983-09-12 | 1985-04-06 | Ibiden Co Ltd | プラグインパッケ−ジとその製造方法 |
JPS6095944A (ja) * | 1983-10-31 | 1985-05-29 | Ibiden Co Ltd | プラグインパツケ−ジとその製造方法 |
JPH07114245B2 (ja) * | 1986-10-17 | 1995-12-06 | 株式会社東芝 | 半導体外囲器 |
JP2800605B2 (ja) * | 1992-12-03 | 1998-09-21 | 日本電気株式会社 | 半導体装置 |
-
1980
- 1980-11-14 JP JP1980163066U patent/JPH0134351Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5784750U (en]) | 1982-05-25 |
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