JPH0134351Y2 - - Google Patents

Info

Publication number
JPH0134351Y2
JPH0134351Y2 JP1980163066U JP16306680U JPH0134351Y2 JP H0134351 Y2 JPH0134351 Y2 JP H0134351Y2 JP 1980163066 U JP1980163066 U JP 1980163066U JP 16306680 U JP16306680 U JP 16306680U JP H0134351 Y2 JPH0134351 Y2 JP H0134351Y2
Authority
JP
Japan
Prior art keywords
package
semiconductor chip
cap
semiconductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980163066U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5784750U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980163066U priority Critical patent/JPH0134351Y2/ja
Publication of JPS5784750U publication Critical patent/JPS5784750U/ja
Application granted granted Critical
Publication of JPH0134351Y2 publication Critical patent/JPH0134351Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1980163066U 1980-11-14 1980-11-14 Expired JPH0134351Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980163066U JPH0134351Y2 (en]) 1980-11-14 1980-11-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980163066U JPH0134351Y2 (en]) 1980-11-14 1980-11-14

Publications (2)

Publication Number Publication Date
JPS5784750U JPS5784750U (en]) 1982-05-25
JPH0134351Y2 true JPH0134351Y2 (en]) 1989-10-19

Family

ID=29521873

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980163066U Expired JPH0134351Y2 (en]) 1980-11-14 1980-11-14

Country Status (1)

Country Link
JP (1) JPH0134351Y2 (en])

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59944A (ja) * 1982-06-25 1984-01-06 Agency Of Ind Science & Technol 半導体装置
JPS6059756A (ja) * 1983-09-12 1985-04-06 Ibiden Co Ltd プラグインパッケ−ジとその製造方法
JPS6095944A (ja) * 1983-10-31 1985-05-29 Ibiden Co Ltd プラグインパツケ−ジとその製造方法
JPH07114245B2 (ja) * 1986-10-17 1995-12-06 株式会社東芝 半導体外囲器
JP2800605B2 (ja) * 1992-12-03 1998-09-21 日本電気株式会社 半導体装置

Also Published As

Publication number Publication date
JPS5784750U (en]) 1982-05-25

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